Silicon Photonics Design From Devices to Systems 1st Edition by Lukas Chrostowski, Michael Hochberg 1107085454 9781107085459

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ISBN 10: 1107085454

ISBN 13: 9781107085459

Author: Lukas Chrostowski; Michael Hochberg

From design and simulation through to testing and fabrication, this hands-on introduction to silicon photonics engineering equips students with everything they need to begin creating foundry-ready designs. In-depth discussion of real-world issues and fabrication challenges ensures that students are fully equipped for careers in industry. Step-by-step tutorials, straightforward examples, and illustrative source code fragments guide students through every aspect of the design process, providing a practical framework for developing and refining key skills. Offering industry-ready expertise, the text supports existing PDKs for CMOS UV-lithography foundry services (OpSIS, ePIXfab, imec, LETI, IME and CMC) and the development of new kits for proprietary processes and clean-room based research. Accompanied by additional online resources to support students, this is the perfect learning package for senior undergraduate and graduate students studying silicon photonics design, and academic and industrial researchers involved in the development and manufacture of new silicon photonics systems.

Silicon Photonics Design From Devices to Systems 1st Table of contents:

Part I Introduction

1 Fabless silicon photonics

1.1 Introduction

1.2 Silicon photonics: the next fabless semiconductor industry

1.2.1 Historical context – Photonics

1.3 Applications

1.3.1 Data communication

1.4 Technical challenges and the state of the art

1.4.1 Waveguides and passive components

1.4.2 Modulators

1.4.3 Photodetectors

1.4.4 Light sources

1.4.5 Approaches to photonic–electronic integration

Monolithic integration

Multi-chip integration

1.5 Opportunities

1.5.1 Device engineering

1.5.2 Photonic system engineering

A transition from devices to systems

1.5.3 Tools and support infrastructure

Electronic–photonic co-design

DFM and yield management

1.5.4 Basic science

1.5.5 Process standardization and a history of MPW services

ePIXfab and Europractice

IME

OpSIS

CMC Microsystems

Other organizations

References

2 Modelling and design approaches

2.1 Optical waveguide mode solver

2.2 Wave propagation

2.2.1 3D FDTD

FDTD modelling procedure

2.2.2 2D FDTD

2.2.3 Additional propagation methods

2D FDTD with Effective Index Method

Beam Propagation Method (BPM)

Eigenmode Expansion Method (EME)

Coupled Mode Theory (CMT)

Transfer Matrix Method (TMM)

2.2.4 Passive optical components

2.3 Optoelectronic models

2.4 Microwave modelling

2.5 Thermal modelling

2.6 Photonic circuit modelling

2.7 Physical layout

2.8 Software tools integration

References

Part II Passive components

3 Optical materials and waveguides

3.1 Silicon-on-insulator

3.1.1 Silicon

Silicon – wavelength dependence

Silicon – temperature dependence

3.1.2 Silicon dioxide

3.2 Waveguides

3.2.1 Waveguide design

3.2.2 1D slab waveguide – analytic method

3.2.3 Numerical modelling of waveguides

3.2.4 1D slab – numerical

Convergence tests

Parameter sweep – slab thickness

3.2.5 Effective Index Method

3.2.6 Effective Index Method – analytic

3.2.7 Waveguide mode profiles – 2D calculations

3.2.8 Waveguide width – effective index

3.2.9 Wavelength dependence

3.2.10 Compact models for waveguides

3.2.11 Waveguide loss

3.3 Bent waveguides

3.3.1 3D FDTD bend simulations

3.3.2 Eigenmode bend simulations

3.4 Problems

3.5 Code listings

References

4 Fundamental building blocks

4.1 Directional couplers

4.1.1 Waveguide mode solver approach

Coupler-gap dependence

Coupler-length dependence

Wavelength dependence

4.1.2 Phase

4.1.3 Experimental data

4.1.4 FDTD modelling

FDTD versus mode solver

4.1.5 Sensitivity to fabrication

4.1.6 Strip waveguide directional couplers

4.1.7 Parasitic coupling

Delta beta coupling

4.2 Y-branch

4.3 Mach–Zehnder interferometer

4.4 Ring resonators

4.4.1 Optical transfer function

4.4.2 Ring resonator experimental results

4.5 Waveguide Bragg grating filters

4.5.1 Theory

Grating coupling coefficient

4.5.2 Design

Transfer Matrix Method

Grating physical structure design

Modelling gratings using FDTD

4.5.3 Experimental Bragg gratings

Strip waveguide gratings

Rib waveguide gratings

Grating period

4.5.4 Empirical models for fabricated gratings

Computation lithography models

Additional fabrication considerations

4.5.5 Spiral Bragg gratings

Thermal sensitivity

4.5.6 Phase-shifted Bragg gratings

4.5.7 Multi-period Bragg gratings

4.5.8 Grating-assisted contra-directional couplers

4.6 Problems

4.7 Code listings

References

5 Optical I/O

5.1 The challenge of optical coupling to silicon photonic chips

5.2 Grating coupler

5.2.1 Performance

5.2.2 Theory

5.2.3 Design methodology

Analytic grating coupler design

Design using 2D FDTD simulations

Results

Design parameters

Cladding and buried oxide

Compact design – focusing

Mask layout

3D simulation

5.2.4 Experimental results

5.3 Edge coupler

5.3.1 Nano-taper edge coupler

Mode overlap calculation approach

FDTD approach

5.3.2 Edge coupler with overlay waveguide

Eigenmode expansion method

5.4 Polarization

5.5 Problems

5.6 Code listings

References

Part III Active components

6 Modulators

6.1 Plasma dispersion effect

6.1.1 Silicon, carrier density dependence

6.2 pn-Junction phase shifter

6.2.1 pn-Junction carrier distribution

6.2.2 Optical phase response

6.2.3 Small-signal response

6.2.4 Numerical TCAD modelling of pn-junctions

6.3 Micro-ring modulators

6.3.1 Ring tuneability

6.3.2 Small-signal modulation response

6.3.3 Ring modulator design

6.4 Forward-biased PIN junction

6.4.1 Variable optical attenuator

6.5 Active tuning

6.5.1 PIN phase shifter

6.5.2 Thermal phase shifter

6.6 Thermo-optic switch

6.7 Problems

6.8 Code listings

References

7 Detectors

7.1 Performance parameters

7.1.1 Responsivity

7.1.2 Bandwidth

Transit time

RC response

Dark current

7.2 Fabrication

7.3 Types of detectors

7.3.1 Photoconductive detector

7.3.2 PIN detector

7.3.3 Avalanche detector

Charge region design

7.4 Design considerations

7.4.1 PIN junction orientation

7.4.2 Detector geometry

Detector length

Detector width

Detector height

7.4.3 Contacts

Contact material

Contact geometry

7.4.4 External load on the detector

7.5 Detector modelling

7.5.1 3D FDTD optical simulations

7.5.2 Electronic simulations

7.6 Problems

7.7 Code listings

References

8 Lasers

8.1 External lasers

8.2 Laser modelling

8.3 Co-packaging

8.3.1 Pre-made laser

8.3.2 External cavity lasers

8.3.3 Etched-pit embedded epitaxy

8.4 Hybrid silicon lasers

8.5 Monolithic lasers

8.5.1 III–V Monolithic growth

8.5.2 Germanium lasers

8.6 Alternative light sources

8.7 Problem

References

Part IV System design

9 Photonic circuit modelling

9.1 Need for photonic circuit modelling

9.2 Components for system design

9.3 Compact models

9.3.1 Empirical or equivalent circuit models

9.3.2 S-parameters

9.4 Directional coupler – compact model

9.4.1 FDTD simulations

9.4.2 FDTD S-parameters

Directional coupler S-parameters

9.4.3 Empirical model – polynomial

9.4.4 S-parameter model passivity

Passivity assessment

Passivity enforcement

9.5 Ring modulator – circuit model

9.6 Grating coupler – S-parameters

9.6.1 Grating coupler circuits

9.7 Code listings

References

10 Tools and techniques

10.1 Process design kit (PDK)

10.1.1 Fabrication process parameters

Silicon thickness and etch

GDS layer map

Design rules

10.1.2 Library

10.1.3 Schematic capture

10.1.4 Circuit export

10.1.5 Schematic-driven layout

10.1.6 Design rule checking

10.1.7 Layout versus schematic

10.2 Mask layout

10.2.1 Components

10.2.2 Layout for electrical and optical testing

10.2.3 Approaches for fast GDS layout

10.2.4 Approaches for space-efficient GDS layout

References

11 Fabrication

11.1 Fabrication non-uniformity

11.1.1 Lithography process contours

11.1.2 Corner analysis

11.1.3 On-chip non-uniformity, experimental results

Ring resonators

Grating couplers

11.2 Problems

References

12 Testing and packaging

12.1 Electrical and optical interfacing

12.1.1 Optical interfaces

Grating couplers

Edge couplers

Individual fibres

Spot-size converter

Fibre array

Free-space coupling

Fibre taper coupling

12.1.2 Electrical interfaces

Bond pads

Probing

Wire bonding

Flip-chip bonding

12.2 Automated optical probe stations

12.2.1 Parts

Sample stage

Fibre array probe

Electrical probes

Microscopes

12.2.2 Software

12.2.3 Operation

Loading and aligning a chip/wafer

Aligning the fibre array

Chip registration

Automated device testing

12.2.4 Optical test equipment

12.3 Design for test

12.3.1 Optical power budgets

12.3.2 Layout considerations

12.3.3 Design review and checklist

References

13 Silicon photonic system example

13.1 Wavelength division multiplexed transmitter

13.1.1 Ring-based WDM transmitter architectures

13.1.2 Common-bus WDM transmitter

13.1.3 Mod-Mux WDM transmitter

13.1.4 Conclusion

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